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Tensile Strain Test Temperature Stage | SIMTRUM Photonics Store

Tensile Strain Temperature Stage

WT-500 is a device which allows users to perform material stress and strain testing process under temperature control with the DIC microtest system. Ideal for testing material phase transformation behaviour, crack initiation, propagation, fracture bending and etc. in high temperatures , the WT-500 is a device suited for the semiconductor, ceramics, polymer materials, biology, flexible electronic materials and other research fields.

Key Features

Dynamic strain measurement

High-speed deformation measurement

Fracture mechanics

Dynamic material test



Cold and Hot Tensile Microtest System


Electrical Tests


Tensile Tester


Tensile Microtest Result

General Specifications

Optical Indicators

Typical Value





Tension Range

0-500N, 0.02% FS



Horizontal movement


Maximal Displacement



Displacement Speed



Mechanical Model

Stretch, compress, bend


Hot and Cold Method

Liquid nitrogen refrigeration, electric heating wire heating, semiconductor heating   and cooling


Upper Limit of Temperature Control

A.100    B.   200    C. 400    D.600


Lower Limit of Temperature Control

A.-100    B.-120    C.-150   D.-190optional


Precision of Temperature Control

±0.1>-120),±0.3<-160),resolution 0.1


Temperature Control Speed



Temperature Control Type

Temperature   control mode

PIDTemperature sensor

PT100Material of sample loader: silver


Light Path

Reflected light path

Transmitted light path available


Removable and replaceable window

Different materials to achieve different wavelengths

Cover Window



Light Transmission Hole

No light transmission hole

Light transmission hole available

Lens Working Distance



Window Defrosting

Blowing and defrosting under negative temperature


Selection of The Observation

Microscope, DIC image analysis and testing


DIC Software Analysis Function

Support synchronization analysis, temperature, sample microstructure, strain analysis, dynamic strain calculation, strength, and nonlinear change detection, young's modulus and position's ratio, elastic-plastic fracture mechanics performance, uniform and non-uniform material deformation behaviour in the process of analysis, all kinds of isotropic and anisotropic material deformation characteristics


DIC Test Accuracy

Support low speed to high speed camera, can achieve accuracy micron level, nanometre   level


Real-time Computing

With   online and offline computing and processing modes


DIC System Compatibility

Compatible with single-camera 2D measurement and multi-camera 3D measurement; Compatible with 32-bit and 64-bit systems.


Sample Table Size

35mm x 8mm


Atmosphere Control

Airtight chamber, can be filled with protective atmosphere


Shell Cooling

Default none, selectable circulating water to prevent overheating of the shell

Vertical installation available


Temperature RangeChamber TypeOptical PathElectrinical Probe Arm

Optical Heating & Cooling Stage

-190°C to 1200°CAir-tight or Vacuum sealedTransmission or Reflection No 

XRD Temperature Control Stage

-190°C to1200°CAir-tight or Vacuum sealedTransmission or Reflection No (Customizable)

Electrical Probe Temperature Stage

-190°C to 1200°CAir-tight or Vacuum sealedTransmission or Reflection Fix probe arm

Electrical Probe Temperature Station

-190°C to 1200°CAir-tight or Vacuum sealedTransmission or Reflection Adjustable probe arm

Tensile Strain Temperature Stage

-190°C to 1200°CAir-tight or Vacuum sealedTransmission or Reflection No(Customizable)
Laser Scanning Confocal Microscope, Confocal Raman Microscope, 
High Speed Line Scan Confocal Microscope
Wde Field Raman Microscope,  
Fluorescence / Photoluminescence Microscope

Time Correlated Single Photon Counting (Solution) 

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Compare Model Drawings & Specs Availability Reference Price


Compare Model Drawings & Specs Availability Reference Price